Equipment Processing and Assembly

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Vacuum Reflow Oven

VADU 100

• Gas supply: Formic acid, N2, O2
• Maximum reflow temperature: 400 °C
• Controllable heating profile
• Maximum sample size: 168 x 280 mm
• Vacuum: <2 Bar

Categories

• Sample Preparation
• Processing and Assembly
• Material Characterization
• Opto-Electrical Characterization
• Mechanical Reliability Test
• Long Term Reliability Test
• Failure Analysis
• 3D printing

Equipment

• Wafer Saw
• Laser Wafer Scriber
• Manual Flip Chip Bonder
• Wire Bonder
• Transfer Molding Machine
• 4-zone Reflow Oven
• 6-zone Reflow Oven
• Vacuum Reflow Oven
• SMT Printer